| 摘要 |
A cooling and heating device uses heat due to emission and radiation generated at walls and windows of a building and a moving vehicle, and copper ultrafine particles as transparent metal and ultrafine particles produced from tin oxide or indium oxide as an n-type semiconductor are deposited on the inner surfaces of the walls and the windows. At least one or more Thomson elements each configured from metal, an n-type semiconductor, and metal are disposed in a polymer film or a Thomson element configured from a carbon nanotube structure cell, a degenerate semiconductor wafer, and a carbon nanotube structure cell is disposed to thereby cause heat absorption or heat generation due to a difference in thermoelectric power (Seebeck coefficient) in the flow direction of an electric current in the voltage application direction of the Thomson element.
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