发明名称 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having a sufficient effect on improvement of resolution and resist removing properties. <P>SOLUTION: A photosensitive resin composition contains (A) a binder polymer including a structural unit based on styrene or styrene derivative, a structural unit based on (meta) acrylic acid benzyl or (meta) acrylic acid benzyl derivative, a structural unit based on (meta) acrylic acid, and a structural unit based on (meta) acrylic acid alkyl ester and having a degree of dispersion of 1.0 to 2.0, (B) a photopolymerizable compound, and (C) a photopolymerization initiator. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012198573(A) 申请公布日期 2012.10.18
申请号 JP20120142488 申请日期 2012.06.25
申请人 HITACHI CHEM CO LTD 发明人 MIYASAKA MASAHIRO;MURAMATSU YUKIKO;NAMIKAWA HANAKO
分类号 G03F7/032;C08F212/06;C08F220/04;C08F220/12;G03F7/004;G03F7/031;G03F7/40;H01L21/027 主分类号 G03F7/032
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