| 摘要 |
The invention relates to a bendable carrier mounting (1) for holding a carrier substrate (13) upon releasing of the carrier substrate (13) from a product substrate (11), wherein solvents (1, 28) for releasing the product substrate (11) while bending the carrier substrate (13) are provided. The invention further relates to a device for releasing a carrier substrate (13) from a product substrate (11) in a releasing direction (L) having the following features: a carrier mounting (1) which can be bent in the releasing direction (1) for holding the carrier substrate (13), a substrate holder (18) for holding the product substrate (11) and solvents (1, 15, 15', 16, 28) for releasing the carrier substrate (13) from the product substrate (11) while bending the carrier substrate (13). The invention also relates to a method for releasing a carrier substrate from a product substrate in a releasing direction (L) having the following steps, in particular having the following sequence: Holding the product substrate by means of a substrate holder and holding the carrier substrate by means of a carrier mounting, which can bend in a releasing direction (L), and releasing the carrier substrate from the product substrate while bending the product substrate. |
