ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
摘要
<p>Provided is an electronic component in which a sealing member is bonded using a resin adhesive that is unlikely to spread before hardening. Also provided is a method for manufacturing the electronic component, wherein the resin adhesive is unlikely to spread before hardening. An electronic component (1) comprises: a first sealing member (10) having a main surface; a second sealing member (15) bonded to the main surface of the first sealing member (10) so as to form a sealed space (15a) together with the main surface of the first sealing member (10); a resin adhesive layer (13) disposed in a frame-shaped bonding region on the main surface of the first sealing member (10) so as to bond the first sealing member (10) and the second sealing member (15); a frame-shaped glass layer (11) provided on the main surface of the first sealing member (10) between the outer perimeter line of the frame-shaped bonding region and the peripheral edge of the main surface of the first sealing member (10); and an electronic component main body (20) disposed in the sealed space (15a). A method for manufacturing the electronic component (1).</p>
