| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a metal base wiring board which properly fills the entire part of a through hole with a resin by suppressing voids, and to provide the metal base wiring board. <P>SOLUTION: A metal base 7A is laminated on a rear surface of a circuit board 3A including a wiring part and a through hole 9A and mounting a power element on the front surface of the circuit board 3A through an insulation material 5A having thermal conductivity and viscosity, and heating and pressurizing are performed between lamination layers of the circuit board 3A, the insulation material 5A, and the metal base 7A with heating plates 25 and 27. Then, the insulation material 5A is moved into the through hole 9A to fill therein while suppressing the increase of an internal pressure of the through hole 9A by air bleeding through a sheet 31, and the circuit board, an insulation layer formed by solidifying the insulation material 5A, and the metal base are laminated. <P>COPYRIGHT: (C)2013,JPO&INPIT |
