HIGH-FREQUENCY PACKAGE

摘要

A high-frequency package (100) according to an embodiment is provided with: a first dielectric substrate (10) having signal wiring and a ground conductor (30) provided to the reverse surface; a high-frequency element (20) connected to the reverse surface of the first dielectric substrate via a first connection conductor (40); a second dielectric substrate (11) having signal wiring and a ground conductor (30) provided to the obverse surface, which faces the aforementioned reverse surface with the high-frequency element positioned therebetween; and a plurality of second connecting conductors (41) arranged so as to surround the high-frequency element, the second connecting conductors providing a connection between the ground conductor on the reverse surface of the first dielectric substrate and the ground conductor on the obverse surface of the second dielectric substrate. The high-frequency package (100) according to the embodiment has a dielectric space (60), which is surrounded by a conductor pattern, formed on the obverse surface of the second dielectric substrate under the high-frequency element.