| 发明名称 |
LAMINATE SHEET, CIRCUIT BOARD, AND SEMICONDUCTOR PACKAGE |
| 摘要 |
The present invention is a laminate sheet (100) obtained by laminating, in the following order, a first prepreg (201) containing a first glass fiber base material layer (101), one or more layers of a second prepreg (202) containing an organic base material layer and not containing a glass fiber base material layer, and a third prepreg (203) containing a second glass fiber base material layer (102). |
| 申请公布号 |
WO2012140908(A1) |
申请公布日期 |
2012.10.18 |
| 申请号 |
WO2012JP02582 |
申请日期 |
2012.04.13 |
| 申请人 |
SUMITOMO BAKELITE CO., LTD.;ONOZUKA, IJI;SATO, KOJI;SHINOZAKI, HIROKI;HOSOMI, TAKESHI |
发明人 |
ONOZUKA, IJI;SATO, KOJI;SHINOZAKI, HIROKI;HOSOMI, TAKESHI |
| 分类号 |
H05K1/03;B32B7/02;B32B15/08;B32B17/04;H01L23/12;H01L23/14;H05K3/28;H05K3/46 |
主分类号 |
H05K1/03 |
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