发明名称 ALUMINUM ELECTROPLATING SOLUTION
摘要 Provided is an aluminum electroplating solution which is highly soluble in non-aqueous solvents and whereby the quantity of electricity conducted in electroplating can be increased and aluminum electroplating can be carried out efficiently and in a short period of time, producing a smooth, glossy plating film. This aluminum electroplating solution is characterized in including an ionic solution comprising an ionic pair of an aluminum metal salt and an organic compound, an organic solvent having a relative permittivity of no more than 8, and an additive that is an aromatic sulfonimide or an N-cyclic compound. Preferably, the organic solvent is hexane, toluene, diethyl ether, ethyl acetate, cyclohexane, xylene, benzene, naphthalene, heptane, cyclopentyl methyl ether, dioxane, or a mixed solvent comprising any one of these solvents.
申请公布号 WO2012141136(A1) 申请公布日期 2012.10.18
申请号 WO2012JP59686 申请日期 2012.04.09
申请人 HITACHI, LTD.;HARADA MOTOKO;NEGISHI YOSHINORI;NAKANO HIROSHI;AKAHOSHI HARUO 发明人 HARADA MOTOKO;NEGISHI YOSHINORI;NAKANO HIROSHI;AKAHOSHI HARUO
分类号 C25D3/44;C25D7/08 主分类号 C25D3/44
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