| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chip heating head capable of mounting a chip on a substrate without junction failure, by suppressing the lowering of the temperature of a heated chip to minimize temperature variation. <P>SOLUTION: A chip heating heater portion 5 is composed of a heater body 10 functioning as a heat source for heating a chip 7; and a collet 11 which is heated by the heater body 10 and grips the chip 7 by vacuum suction and the like. In a heat transmission direction from the heater body 10 to the chip 7, the contact density of the collet 11 and the chip 7 is different in a center part and an outer peripheral part of the chip 7. Concretely, a contacting portion in which the collet 11 contacts with the chip 7 is provided at the center part of the chip 7, and a non-contacting portion in which the collet 11 does not contact with the chip is provided at the outer peripheral portion of the chip 7. Therefore, a temperature distribution of the chip 7 is made to be uniform, and the chip 7 can be mounted on a substrate without causing junction failures such as non-fusion of solder or void remaining. <P>COPYRIGHT: (C)2013,JPO&INPIT |
