发明名称 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
摘要 <P>PROBLEM TO BE SOLVED: To enable formation of a continuous plating film at least as a portion of an external electrode to connect between exposed terminals of a plurality of internal electrodes, even when each gap between adjacent exposed terminals of the internal electrodes is wide. <P>SOLUTION: A component body 2 having a plurality of ceramic layers 95 and the plurality of internal electrodes 91-93, in which each portion of the plurality of internal electrodes is exposed, is formed to have conductive regions 96-98 with diffused formation of conductive components included in the internal electrodes, on the end face of the ceramic layer 95 located between the neighboring exposed terminals of the plurality of internal electrodes. The ceramic layer is preferably composed of a glass ceramic including a glass component of 10 wt.% or more. To form external electrodes 3-6, the plating film is directly formed on the component body 2 by plating-growing the exposed terminals of the internal electrodes and the conductive regions as a core of plating deposition. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012199353(A) 申请公布日期 2012.10.18
申请号 JP20110061984 申请日期 2011.03.22
申请人 MURATA MFG CO LTD 发明人 OGAWA MAKOTO;MOTOKI AKIHIRO;SARUKUI MASATO;OGAWA WATARU
分类号 H01G4/30;H01F27/29;H01F41/10;H01G4/12;H01G4/232;H03H7/01 主分类号 H01G4/30
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