| 摘要 |
<P>PROBLEM TO BE SOLVED: To efficiently transmit heat generated from a semiconductor chip to heat radiation fins and improve the heat exhaust properties of the heat radiation fins. <P>SOLUTION: A ventilation passage 2 and openings 3a to 3e communicating with the ventilation passage 2 are formed at a ventilation box body 1. Semiconductor packages 4a to 4e are attached to the ventilation box body 1 through the openings 3a to 3e, respectively, to form a semiconductor module. Heat radiation fins 16 provided at the semiconductor packages 4a to 4e are arranged along the ventilation passage 2. <P>COPYRIGHT: (C)2013,JPO&INPIT |
