| 摘要 |
Disclosed is a double-head grinding method in which both surfaces of a work are simultaneously grinded by rotating a pair of ring-shaped grinding stones in a state where the grinding stones faces the work, and by supporting and rotating the work along the radial direction from an outer peripheral side, wherein the work is grinded by adjusting outer and inner diameters of the grinding stones and the rotational speed of the grinding stones such that the difference between the peripheral speed of outer peripheral portions of the rotating grinding stones and the peripheral speed of inner peripheral portions thereof is not less than 30 meters per minute and not more than 45 meters per minute, and the ratio of the difference between the outer peripheral portion peripheral speed and the inner peripheral portion peripheral speed relative to the outer peripheral portion peripheral speed is at least 10%. Thus, there are provided the double-head grinding method and a double-head grinding apparatus, in which nanotopography is improved by suppressing local deformation of a wafer during double-head grinding causing deterioration of the nanotopography of the wafer, and stable and continuous grinding is possible.
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