| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent local rising of the temperature of a heat-generating chip. <P>SOLUTION: A soaking member 118 is disposed between an insulation film 117 of the heat-generating chip 100 having a resistance pattern 113 which is a heat generating part and a sealing film 360. The heat conductivity in an air layer 362 part is lower than in the other part of the sealing film 360, and the temperature in the vicinity of the air layer is liable to be high. However, as the heat-generating chip 100 has the soaking member 118, the heat generated in the resistance pattern 113 is diffused by the soaking member 118 even if the air layer 362 is formed in the sealing film 360 in such a way as in contact with the heat-generating chip 100, and the generated heat flows onto the sealing film 360 from a part where the soaking member 118 is directly in contact with the sealing film 360. As a result, a part where the temperature is locally high is not formed in the periphery of the air layer 362. <P>COPYRIGHT: (C)2013,JPO&INPIT |
