| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lens material for optical semiconductor device which can form a lens of good lens shape and can enhance heat resistance of the lens. <P>SOLUTION: The lens material for optical semiconductor device contains first organopolysiloxane (excepting organopolysiloxane having a hydrogen atom bonded to a silicon atom) represented by the following formula (1) and having an alkenyl group bonded to a silicon atom, second organopolysiloxane represented by the following formula (51) and having a hydrogen atom bonded to a silicon atom, a catalyst for hydrosilylation reaction, and silicon oxide particles. The content ratio of aryl group bonded to the silicon atom in the first, second organopolysiloxane is 5 mol% or lower, respectively. <P>COPYRIGHT: (C)2013,JPO&INPIT |
