发明名称 Method and Apparatus For Depositing A Material Layer Originating From Process Gas On A Substrate Wafer
摘要 An apparatus for depositing a material layer originating from process gas on a substrate wafer, contains: a reactor chamber delimited by an upper dome, a lower dome, and a side wall; a susceptor for holding the substrate wafer during the deposition of the material layer; a preheating ring surrounding the susceptor; a liner, on which the preheating ring is supported in a centered position wherein a gap having a uniform width is present between the preheating ring and the susceptor; and a spacer acting between the liner and the preheating ring, the spacer keeping the preheating ring in the centered position and providing a distance &Dgr; between the preheating ring and the liner.
申请公布号 US2012263875(A1) 申请公布日期 2012.10.18
申请号 US201213407832 申请日期 2012.02.29
申请人 BRENNINGER GEORG;AIGNER ALOIS;HAGER CHRISTIAN;SILTRONIC AG 发明人 BRENNINGER GEORG;AIGNER ALOIS;HAGER CHRISTIAN
分类号 C23C16/00 主分类号 C23C16/00
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