| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a driver module structure and a method of manufacturing a driver module which can reduce costs by facilitating processing of a heat radiation body while maintaining heat radiation by ensuring adhesion between the heat radiation body and a semiconductor device. <P>SOLUTION: A PDP driver 1 includes a flexible substrate 2 having a wiring pattern 23 formed thereon, a semiconductor device 3 mounted on the flexible substrate 2, and a heat radiation body 4 having a recess 41 for storing the semiconductor device 3 formed therein. A thermally conductive adhesive tape 5 for performing heat transfer from the semiconductor device 3 to the heat radiation body 4 is installed as an integrated body continued from an adhesive surface 43 located on one side of an opening of the recess 41 via a bottom surface 42 of the recess 41 adhered to the semiconductor device 3 to an adhesive surface 44 located on the other side of the opening of the recess 41. The flexible substrate 2 and the heat radiation body 4 are in a non-adhesive state in which a part of an opening edge 46 of the recess 41 serves as a ventilation path T between the recess 41 and the exterior. <P>COPYRIGHT: (C)2013,JPO&INPIT |
