| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a ceramic multilayer substrate on whose surface an external wiring part can be formed. <P>SOLUTION: A manufacturing method of a ceramic multilayer substrate 1 having a ceramic substrate part 2 formed by burning a plurality of ceramic sheets and a chip-type electronic component 3 arranged inside the ceramic substrate part 2 comprises: a ceramic sheet preparation step of forming a hole 5 in a portion in which the chip-type electronic component 3 of the at least one ceramic sheet is arranged; a lamination arrangement step of arranging the chip-type electronic component 3 in the hole 5 of a green sheet in which the hole 5 has been formed, laminating a plurality of green sheets, and then preparing a chip-type electronic component - green sheet laminate 12; a pressurization step of pressurizing the chip-type electronic component - green sheet laminate 12 in a thickness direction of the chip-type electronic component - green sheet laminate 12; and a green sheet burning step of applying a burning temperature of the green sheet. <P>COPYRIGHT: (C)2013,JPO&INPIT |
