<p>The method (200) involves applying selective electromagnetic irradiation to a source substrate (210) at a defined wavelength such that damaged material of a surface region of the substrate absorbs the irradiation to facilitate selective removal of regions in relief. The irradiation is controlled by an optical device that detects the regions in relief, so that the irradiation is carried out locally on the detected regions in relief. Chemical-mechanical polishing (220) of the surface region is conducted using a colloidal acid solution that contains an oxidizing agent and/or diamond particles. The selective electromagnetic irradiation of the substrate is carried out by a laser such as pulsed-mode yttrium-aluminum-garnet laser. An independent claim is also included for a method for transferring a layer from a recycled source substrate to a support substrate.</p>
