| 发明名称 |
METHOD FOR FORMING FILM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND SUBSTRATE TREATMENT SYSTEM |
| 摘要 |
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| 申请公布号 |
EP1655771(B1) |
申请公布日期 |
2012.10.17 |
| 申请号 |
EP20040747870 |
申请日期 |
2004.07.23 |
| 申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
NISHIZAWA, KENICHI;TERAI, YASUHIRO;ASANO, AKIRA |
| 分类号 |
H01L21/314;C23C16/26;C23C16/56;H01L21/205;H01L21/3065;H01L21/31;H01L21/312;H01L21/316;H01L21/3205;H01L21/768;H01L23/52;H01L23/522 |
主分类号 |
H01L21/314 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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