Device and method for topping at least one section of a substrate with at least one topping component and use of the device

摘要

Device (Bv) for filling of at least one portion of at least one substrate (Su) with at least one filling component, comprises (a) at least an applicator for the filling component, (b) at least one carrier surface for the substrate, and (c) at least one intermediate filling device, which has at least one intermediate filling surface for the filling component and is arranged above the carrier surface and below the applicator. The filling component is deposited on the intermediate filling surface by the applicator. The intermediate filling surface is maintained in a fixed state. Device (Bv) for filling of at least one portion of at least one substrate (Su) with at least one filling component, comprises (a) at least an applicator for the filling component, (b) at least one carrier surface for the substrate, and (c) at least one intermediate filling device, which has at least one intermediate filling surface for the filling component and is arranged above the carrier surface and below the applicator. The filling component is deposited on the intermediate filling surface by the applicator. The intermediate filling surface is maintained in a fixed state, such that the filling component rests on the substrate before transferring, and the intermediate filling surface is moveable, such that the filling component from at least one deposition surface (Df) on the intermediate filling surface is transferred to the exact position of the substrate. An independent claim is also included for method for filling of at least one portion of a substrate with at least one filling component, comprising (i) promoting the filling component by at least one applicator on at least one intermediate filling surface of at least one intermediate filling device and (ii) positioning of the substrate on the carrier surface below the intermediate filling surface, where the method further comprises (iii) moving the intermediate filling surface, such that the filling component from at least one deposition surface on the intermediate filling surface is transferred to the exact position of the substrate, during which the intermediate filling surface is maintained in a fixed state.