| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a noncontact type signal transmission device and method that can be adapted to micronizing of electrodes and achieve high-speed transmission and long-distance transmission of electric signals between remote chips and boards. <P>SOLUTION: A voltage signal can be detected in a noncontact state by a detecting device having a first electrode 3a provided on a semiconductor package 5 or integrated circuit chip, a second electrode 3b provided on a packaging substrate 6 and disposed nearby the first electrode 3a, an optoelectric field element 1 disposed between the first electrode 3a and second electrode 3b, an optical transmission line 2 connected to the optoelectric field element 1, a light incidence means 31 of making light incident on the optoelectric field element 1 from the other side of the optical transmission line 2, and an optical detecting means 41 of detecting light reflected in the optoelectric field element 1. <P>COPYRIGHT: (C)2009,JPO&INPIT |
