SYSTEM AND METHOD FOR OVERMOLDING OF DECORATED PLASTIC PARTS
摘要
<p>An electronic device enclosure includes a first structural layer having a first surface and a second surface. A decorative feature is formed on the first surface of the first structural layer. The enclosure further includes a second structural layer, which is formed directly on the first surface of the first structural layer. The second structural layer is formed over the decorative feature by an overmolding process.</p>
