发明名称 |
THIN FILM LAMINATING DEVICE AND LAMINATING METHOD |
摘要 |
PURPOSE: A thin film join device and a joining method thereof are provided to prevent bubbles and wrinkles of a thin film because a rolled portion generated in full cutting of the film is smoothed by spraying a gas through a gas spraying nozzle. CONSTITUTION: A thin film join device comprises a substrate transferring roller(200), a cutting unit(400), and a joining roller(500). The substrate transferring roller supplies a substrate(100). The cutting unit units a roll thin film(300). The joining roller laminates the substrate transferred by the transferring roller and the roll thin film cut by the cutting unit. A gas spraying nozzle is arranged in a front side of the joining roller and smoothes a portion of the roll thin film rolled up oppositely to a transfer direction of the substrate. [Reference numerals] (AA) Transferring direction
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申请公布号 |
KR20120113873(A) |
申请公布日期 |
2012.10.16 |
申请号 |
KR20110031533 |
申请日期 |
2011.04.06 |
申请人 |
SAMSUNG CORNING PRECISION MATERIALS CO., LTD. |
发明人 |
CHE, KYUNG SUCK;CHOI, YOUN OK |
分类号 |
B29C65/20;B29C57/00 |
主分类号 |
B29C65/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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