发明名称 |
Wiring board and manufacturing method thereof |
摘要 |
A wiring board includes a substrate having a surface made of an insulating resin. An adhesion layer is formed on the substrate. A wiring layer is formed on the adhesion layer. The adhesion layer is formed by a nitrided NiCu alloy containing nitrogen therein. A nitrogen content of the nitrided NiCu alloy is within a range from 1 atoms % to 5 atoms %. |
申请公布号 |
US8288659(B2) |
申请公布日期 |
2012.10.16 |
申请号 |
US20100869805 |
申请日期 |
2010.08.27 |
申请人 |
YAMASAKI TOMOO;SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
YAMASAKI TOMOO |
分类号 |
H05K1/02 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|