发明名称 Method of assembling a thermal expansion compensator
摘要 A thermal expansion compensator is provided and includes a first electrode structure having a first surface, a second electrode structure having a second surface facing the first surface and an elastic element bonded to the first and second surfaces and including a conductive element by which the first and second electrode structures electrically and/or thermally communicate, the conductive element having a length that is not substantially longer than a distance between the first and second surfaces.
申请公布号 US8286335(B2) 申请公布日期 2012.10.16
申请号 US201113183128 申请日期 2011.07.14
申请人 DETERMAN WILLIAM;MATEJCZYK DANIEL EDWARD;HAMILTON SUNDSTRAND SPACE SYSTEMS INTERNATIONAL, INC. 发明人 DETERMAN WILLIAM;MATEJCZYK DANIEL EDWARD
分类号 H01F7/06 主分类号 H01F7/06
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