发明名称 |
Method of assembling a thermal expansion compensator |
摘要 |
A thermal expansion compensator is provided and includes a first electrode structure having a first surface, a second electrode structure having a second surface facing the first surface and an elastic element bonded to the first and second surfaces and including a conductive element by which the first and second electrode structures electrically and/or thermally communicate, the conductive element having a length that is not substantially longer than a distance between the first and second surfaces. |
申请公布号 |
US8286335(B2) |
申请公布日期 |
2012.10.16 |
申请号 |
US201113183128 |
申请日期 |
2011.07.14 |
申请人 |
DETERMAN WILLIAM;MATEJCZYK DANIEL EDWARD;HAMILTON SUNDSTRAND SPACE SYSTEMS INTERNATIONAL, INC. |
发明人 |
DETERMAN WILLIAM;MATEJCZYK DANIEL EDWARD |
分类号 |
H01F7/06 |
主分类号 |
H01F7/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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