发明名称 |
Method of fabricating a module, for millimeter wave multi-gigabit wireless systems |
摘要 |
A method of fabricating an ultra-high frequency module is disclosed. The method includes providing a top layer; drilling the top layer; milling the top layer; providing a bottom; milling the bottom layer to define a bottom layer cavity; aligning the top layer and the bottom layer; and adhering the top layer to the bottom layer. The present invention also includes an ultra-high frequency module operating at ultra-high speeds having a top layer, the top layer defining a top layer cavity; a bottom layer, the bottom layer defining a bottom layer cavity; and an adhesive adhering both the top layer to the bottom layer, wherein the top layer and the bottom layer are formed from a large area panel of a printed circuit board. |
申请公布号 |
US8286328(B2) |
申请公布日期 |
2012.10.16 |
申请号 |
US20110984035 |
申请日期 |
2011.01.04 |
申请人 |
PINEL STEPHANE;LASKAR JOY;GEORGIA TECH RESEARCH CORPORATION |
发明人 |
PINEL STEPHANE;LASKAR JOY |
分类号 |
H01S4/00 |
主分类号 |
H01S4/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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