| 摘要 |
PURPOSE: A method for manufacturing an LED package having a glass cover is provided to control a color coordinate in a package of a COB(Chip On Board) mode by having uniform color distribution of light emitted from the LED package without a separate structure and an additional process. CONSTITUTION: A mask having a plurality of exposing regions is formed at one side of a glass substrate. An internal space is formed by eliminating a substrate of an exposed region by the mask. A photoelectric transformation layer(12) is formed at one side of the glass substrate by spraying a mixture of resin material and fluorescent substances. The glass substrate is divided within a unit glass cover(11). The glass cover is attached to a wiring substrate so that an LED chip(15) is arranged inside a space of the unit glass cover.
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