发明名称 Phase change memory device with air gap
摘要 A semiconductor device is provided which includes a bottom electrode contact formed on a substrate, and a dielectric layer formed on the bottom electrode contact. The device further includes a heating element formed in the dielectric layer, wherein the heating element is disposed between two air gaps separating the heating element from the dielectric layer, and a phase change element formed on the heating element, wherein the phase change element includes a substantially amorphous background and an active region, the active region capable of changing phase between amorphous and crystalline. A method of forming such a device is also provided.
申请公布号 US8288750(B2) 申请公布日期 2012.10.16
申请号 US20100770344 申请日期 2010.04.29
申请人 SHEN MING-HUEI;LIU SHIH-CHANG;TSAI CHIA-SHIUNG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 SHEN MING-HUEI;LIU SHIH-CHANG;TSAI CHIA-SHIUNG
分类号 H01L29/04;H01L47/00 主分类号 H01L29/04
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