METHOD FOR MANUFACTURING ELECTRONIC DEVICE

摘要

PURPOSE: A method for manufacturing an electronic device is provided to use various patterns on a multilayer film by using a patterning process before transferring the multilayer film into an adhesive material. CONSTITUTION: A multilayer film is formed on the upper surface of a substrate(S100). An adhesive material adheres to the upper surface of the multilayer film by selectively applying heat using laser(S200). The adhesive material is separated by being cooled down. The multilayer film is transferred into the adhesive material(S300). The adhesive material adheres to an electronic device(S400). [Reference numerals] (AA) Start; (BB) End; (S100) Forming a multilayer film on the upper surface of a substrate; (S200) Adhering an adhesive material to the upper surface of the multilayer film by selectively applying heat using laser; (S300) Transferring the multilayer film to the adhesive material by cooling and separating the adhesive material; (S400) Adhering the adhesive material to an electronic device