| 摘要 |
PURPOSE: An FBGA package and a manufacturing method thereof are provided to improve the reliability of an FBGA package manufacturing process by securing design and expandability of a top wiring part. CONSTITUTION: An expansion pad(212b1) is formed on the upper side of an interposer(202). The expansion pad is electrically connected to a rewiring pad(212a1) through a via hole. A semiconductor chip is adhered to the interposer in contact with the expansion pad. An encapsulant(220) molds the front of the semiconductor chip. A solder ball(222) is attached to the rewiring pad. |
