发明名称 |
BREAKING APPARATUS AND BREAKING METHOD |
摘要 |
PURPOSE: A breaking apparatus and a breaking method are provided to remove the surface damage of a brittle material substrate while dividing by dividing along a scribing line without the contact of the brittle material substrate and a suction pad. CONSTITUTION: A breaking apparatus comprises a table(2), a supporting unit(11), and a suction pad(21). The surface of a brittleness material substrate(W) accommodating a scribe line(S) is located on a table while facing upward. The supporting unit holds a brittle material substrate in a right position. The suction pad comprises a pressure reducing space and jetting holes. The scribing line on the brittleness plate is formed for the facilitate division of the brittleness material substrate. |
申请公布号 |
KR20120114147(A) |
申请公布日期 |
2012.10.16 |
申请号 |
KR20120007153 |
申请日期 |
2012.01.25 |
申请人 |
MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. |
发明人 |
TOMINAGA KEISUKE |
分类号 |
B26F3/04;B28D5/00;C03B33/03;H01L21/301 |
主分类号 |
B26F3/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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