发明名称 |
Semiconductor device and method of forming a wafer level package structure using conductive via and exposed bump |
摘要 |
A semiconductor device has a carrier. A semiconductor wafer including a semiconductor die is mounted to the carrier with an active surface of the semiconductor die facing away from the carrier. A plurality of bumps is formed over the active surface of the semiconductor die. An opening is formed in a periphery of the semiconductor die. An encapsulant is deposited over the carrier and semiconductor die, in the opening, and around the plurality of bumps such that an exposed portion of the plurality of bumps is devoid of encapsulant. A conductive via is formed through the encapsulant, within the opening, and extends to the carrier. A conductive layer is formed over the encapsulant and electrically connects to the conductive via and the exposed portion of the plurality of bumps. The carrier is removed to expose an end of the conductive via.
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申请公布号 |
US8288203(B2) |
申请公布日期 |
2012.10.16 |
申请号 |
US201113035617 |
申请日期 |
2011.02.25 |
申请人 |
CHO SUNGWON;CHOI JOONYOUNG;CHOI DAESIK;STATS CHIPPAC, LTD. |
发明人 |
CHO SUNGWON;CHOI JOONYOUNG;CHOI DAESIK |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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