| 摘要 |
A method of manufacturing an integrated circuit, IC, package comprising radio frequency, RF, components, the method comprising: electrically connecting a printed circuit pattern on an external major surface of an IC assembly to an RF testing motherboard by bringing them together with an interposed adaptor layer, the adaptor layer comprising a double-sided PCB, printed circuit board, with conductive vias between its printed circuit layers; RF testing the IC assembly using the RF testing motherboard, while RF tuning components of the IC assembly; and separating the IC assembly and connecting its major surface to a solder ball grid array, BGA, which has substantially the same RF impedance as the adaptor at RF signal paths from the IC assembly to the BGA.
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