| 发明名称 |
Electrostatic post exposure bake apparatus and method |
| 摘要 |
An Electrostatic Post Exposure Bake (EPEB) subsystem comprising an Electrostatic Bake Plate (EBP) configured in a processing chamber in an EPEB subsystem, wherein the EPEB wafer comprises an exposed masking layer having unexposed regions and exposed regions therein and the EPEB wafer is developed using the EBP. |
| 申请公布号 |
US8288174(B1) |
申请公布日期 |
2012.10.16 |
| 申请号 |
US201113070723 |
申请日期 |
2011.03.24 |
| 申请人 |
RATHSACK BENJAMEN M.;HEAD BRIAN;SCHEER STEVEN;TOKYO ELECTRON LIMITED |
发明人 |
RATHSACK BENJAMEN M.;HEAD BRIAN;SCHEER STEVEN |
| 分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
| 代理机构 |
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