发明名称 |
Bonding wire profile for minimizing vibration fatigue failure |
摘要 |
Any two segments of a wire bonded on two bond pads at different elevations can be distinguished by a stationary node (or zero-displacement) during its second-mode vibration. In order to boost the natural frequency of such a bond wire to avoid a second-mode resonance occurring at the lowest frequency in the in-plane vibration, a wire can be optimized by connecting two equalized (shortest possible) wire segments to replace a wire consisting of a larger segment and a shorter segment. The purpose is to re-distribute a larger vibration movement in the longer segment with a lower stiffness of an arbitrary bond wire to two smaller equalized segments of an optimized wire to reduce an in-plane vibration to significantly improve the wire natural frequency and reliability in a harsh vibration environment such as over 30 kHz.
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申请公布号 |
US8288876(B2) |
申请公布日期 |
2012.10.16 |
申请号 |
US20100780106 |
申请日期 |
2010.05.14 |
申请人 |
CHIOU JEN-HUANG ALBERT;CONTINENTAL AUTOMOTIVE SYSTEMS, INC. |
发明人 |
CHIOU JEN-HUANG ALBERT |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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