发明名称 |
Single type substrate treating apparatus and method |
摘要 |
Provided are a single type substrate treating apparatus and method. A polishing unit is disposed in a process chamber for polishing a substrate chemically and mechanically, and a cleaning unit is disposed in the same process chamber for cleaning the substrate. Therefore, according to the single substrate treating apparatus and method, a polishing process and a cleaning process can be performed on a substrate in the same process chamber by a single substrate treating method in which substrates are treated one by one. |
申请公布号 |
US8287333(B2) |
申请公布日期 |
2012.10.16 |
申请号 |
US20080273064 |
申请日期 |
2008.11.18 |
申请人 |
CHOI KI HOON;KOO GYO-WOOG;CHOI JUNG BONG;SEMES CO., LTD |
发明人 |
CHOI KI HOON;KOO GYO-WOOG;CHOI JUNG BONG |
分类号 |
B24B1/00;H01L21/304 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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