发明名称 |
METHOD AND SYSTEM FOR PACKAGING A MEMS DEVICE |
摘要 |
PURPOSE: A method for packaging a micro electro-mechanical device and a system thereof are provided to miniaturize a product and prevent the degradation of performance. CONSTITUTION: A pixel array includes two of interference modulators(12a,12b). A movable layer(14a) having high reflexibility in a left interference modulator is located away from a fixed layer(16a) having partial reflexibility in the left interference modulator. A movable layer(14b) having high reflexibility adjoins a fixed layer(16b) having partial reflexibility in the right interference modulator. The movable layers are formed by posts(18) and a series of parallel strips made of a metal layer deposited on a surface of sacrifice materials between the posts. [Reference numerals] (AA) 0 bolt; (BB) 10 bolt |
申请公布号 |
KR20120114192(A) |
申请公布日期 |
2012.10.16 |
申请号 |
KR20120094769 |
申请日期 |
2012.08.29 |
申请人 |
QUALCOMM MEMS TECHNOLOGIES, INC. |
发明人 |
MILES MARK W.;SAMPSELL JEFFREY B.;PALMATEER LAUREN;ARBUCKLE BRIAN W.;FLOYD PHILIP D. |
分类号 |
G02B26/08;B81B7/02 |
主分类号 |
G02B26/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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