METHOD FOR GRINDING WAFER

摘要

PURPOSE: A method for grinding a wafer is provided to prevent the loading of a grinding wheel by filling a gap between a substrate and a chamfer with resins. CONSTITUTION: A light emitting layer(11) is laminated on the surface of a sapphire substrate(10). A chamfer(12) is formed in the outside of a surface(1a) of a wafer(1). An acryl based adhesive is coated on a surface(2a) of a hard substrate(2). The hard substrate is larger than the wafer. Resins(3) are filled in a gap between the chamfer and the hard substrate.