SILICONE THROUGH VIA FOR BONDING CHIPS, CHIP AND MOUNTED CHIPS COMPRISING THE SAME, AND METHOD FOR BONDING MOUNTED CHIPS BY ELECTROPLATING

摘要

PURPOSE: A silicon through via for bonding a chip, the chip including the same, a laminated chip, and a method for bonding the laminated chip using an electroplating are provided to improve conductivity and bonding strength by forming a metal bonding part with the electroplating. CONSTITUTION: A metal part(140) fills a silicon through via(170). A metal pad(150) is laminated on the silicon through via. A metal bump(160) is protruded from the chip with a preset height. The metal bump and the metal pad are made of the same metal materials. An insulation layer(120) and a metal seed layer(130) are successively laminated on the silicon through via.