POWER LEAD-ON-CHIP BALL GRID ARRAY PACKAGE

摘要

A PACKAGING ASSEMBLY (30), SUCH AS A BALL GRID ARRAY PACKAGE, IS FORMED WHICH DISTRIBUTES POWER ACROSS AN INTERIOR REGION OF AN INTEGRATED CIRCUIT DIE (52) BY USING AN ENCAPSULATED PATTERNED LEADFRAME CONDUCTOR (59) THAT IS DISPOSED OVER THE DIE (52) AND BONDED TO A PLURALITY OF BONDING PADS (45) FORMED IN A BGA CARRIER SUBSTRATE (42) AND IN THE INTERIOR DIE REGION, THEREBY ELECTRICALLY COUPLING THE INTERIOR DIE REGION TO AN EXTERNALLY PROVIDED REFERENCE VOLTAGE.