| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can easily fix a semiconductor module and a cooler. <P>SOLUTION: A semiconductor device 10 comprises: a semiconductor module 40; a cooler 30 for cooling the semiconductor module 40; a terminal board 20 with a capacitor to be electrically connected with a terminal of the semiconductor module 40; a leaf spring 50 serving as a spring member; and a bracket 60 serving as a spring member support. The leaf spring 50 is arranged on the semiconductor module 40 and the cooler 30 arranged on the terminal board 20 with the capacitor in a laminated manner to push the semiconductor module 40 and the cooler 30 toward the terminal board 20. The bracket 60 is arranged on the leaf spring 50 and fixed to the terminal board 20 with the capacitor to bias the leaf spring 50 to push the semiconductor module 40 and the cooler 30 toward the terminal board 20 with the capacitor. <P>COPYRIGHT: (C)2013,JPO&INPIT |
