发明名称 MOTHERBOARD
摘要 A motherboard includes a circuit board, a plurality of electronic components, a metal cover and a flexible heat-conducting component. The electronic components are disposed at the circuit board. The metal cover covers the circuit board. The flexible heat-conducting component is disposed between the circuit board and the metal cover and contacts the electronic components and the metal cover.
申请公布号 US2012257356(A1) 申请公布日期 2012.10.11
申请号 US201213434879 申请日期 2012.03.30
申请人 YEN HENG-YU;HUANG PAI-CHING;ASUSTEK COMPUTER INC. 发明人 YEN HENG-YU;HUANG PAI-CHING
分类号 H05K7/20 主分类号 H05K7/20
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