SOLID-STATE IMAGE PICKUP DEVICE, AND METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE

摘要

Provided is a solid-state image pickup device which can efficiently perform heat dissipation and electromagnetic shielding. This solid-state image pickup device is provided with: an MCM substrate (41), which has disposed thereon a sensor (42) and an SiP (44) which processes output signals transmitted from the sensor (42); a power supply substrate (61) having a power supply IC (62) disposed thereon; and a shield section (50), which is disposed between the MCM substrate (41) and the power supply substrate (61) such that the shield section covers the power supply IC (62), and which has electrical conductivity and heat conductivity.