| 摘要 |
<p>The invention relates to an electronic component comprising a number of pins (10) to be soldered to a printed circuit board (2), the component furthermore comprising a dissipating block (11) for dissipating heat generated by the component (1), the dissipating block (11) being intended to be soldered to a conductive zone (211) on the surface of the printed circuit board (2), the component (1) being characterized in that it comprises testing means (110, 10a), taking the form of a pin (10a) electrically connected directly to the dissipating block (11), for testing electrical properties, such as the continuity or impedance, of the connection formed between the dissipating block (11) and the conductive zone (211). The invention also relates to a circuit board incorporating the component.</p> |
