| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a device and a method for polishing a substrate capable of automatically checking the tear of an adsorption sheet for adsorbing and holding the substrate. <P>SOLUTION: The polishing device 12 includes an inspection device 10 having three photoelectric sensors 40 to 44. The photoelectric sensors 40 to 44 detect the tear of a film member 16 which is conveyed from a sticking stage 22 to a polishing stage 26. Each of the photoelectric sensors 40 to 44 includes a projection unit 46 for projecting light and a light receiving unit 48 for receiving the light. The projection unit 46 and the light receiving unit 48 are arranged to face each other in the adsorption sheet 32 of the film member 16. The light is projected from the projection unit 46 to the adsorption sheet 32, and the light reflected from the adsorption sheet 32 is received by the light receiving unit 48. A detection unit 50 determines the occurrence of the tear in the film member 16 on the basis of the change of the received light amount. <P>COPYRIGHT: (C)2013,JPO&INPIT |
