| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve adhesion between a ceramic substrate and a metal sputtering film. <P>SOLUTION: In the ceramic substrate 10, an insulating layer, that is, a highly Al-concentrated layer 12 is formed on a surface of the ceramic substrate 10, wherein the insulating layer is high in Al concentration than the inside thereof. Thus a lot of Al atoms exist on the surface of the ceramic substrate 10. When the metal sputtering film 13 is formed on the substrate, a strong bond is made through oxygen between the Al atom on the surface of the ceramic substrate 10 and a metal atom of the metal sputtering film 13, thereby improving the adhesion between the ceramic substrate 10 and the metal sputtering film 13. <P>COPYRIGHT: (C)2013,JPO&INPIT |
