INTER-CHIP COMMUNICATION SYSTEM AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an inter-chip communication system or the like which is capable of improving transmission efficiency of a radio wave without increasing the size of a device.

SOLUTION: A semiconductor chip 1A has a multilayer wiring structure. A body semiconductor substrate is formed in a body semiconductor substrate layer 2A. A dipole antenna 7A transmits a radio wave corresponding to an electric signal outputted from the body semiconductor substrate, in a stacking direction of the multilayer wiring structure and receives a radio wave propagating in the stacking direction to output an electric signal corresponding to this radio wave to the body semiconductor substrate 2A. A metamaterial 5A is disposed on the dipole antenna 7A via an insulating layer 6A.

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