发明名称 HARD CANDY WITH WAFER-LIKE TEXTURE AND METHOD OF MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a hard candy having a new crispy texture like a wafer, and a method of manufacturing the same. <P>SOLUTION: A hard candy dough obtained by heating and mixing starch syrup, sugar and water, further adding fat and an emulsifier thereto and boiling them down is formed into a cylindrical shape. The process of aerating air in the cylindrical hard candy, expanding the candy into a balloon shape to an expansion ratio of 1.5 to 5.0 times, drawing it, and folding it is repeated three to five times, thereby the hard candy having a capillary-like hollow structure and having a crispy texture like wafers can be obtained. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012191863(A) 申请公布日期 2012.10.11
申请号 JP20110056492 申请日期 2011.03.15
申请人 UHA MIKAKUTO CO LTD 发明人 URANO NOZOMI;NAGASHIMA RYO;TAKEMURA KAZUYUKI;SUZUKI KIYOSHI;MATSUI TAKEKI;YAMADA YASUMASA;YAMADA ICHIRO
分类号 A23G3/34 主分类号 A23G3/34
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