发明名称 |
METHOD FOR MANUFACTURING INSERTS FOR ELECTRONIC PASSPORTS |
摘要 |
The invention relates to a method for manufacturing inserts (41) provided with an electronic module (44) supporting a chip and an antenna (43), comprising the steps of: supplying (30) top and bottom substrate sheets (46) for a plurality of inserts, said substrates being provided with cavities (42) for subsequently inserting an electronic module in each cavity; providing (31) an antenna for each insert; providing (33) at least one layer of adhesive; providing (32) an electronic module for each insert; (36) stacking and assembling by lamination (37) a bottom substrate sheet (46), a first layer of adhesive (54), a plurality of antennas (43), a second layer of adhesive (54) and a top substrate sheet (46); cutting (38) the laminated assembly such as to obtain inserts each provided with an antenna; inserting the electronic modules (44) in the cavities (42) after the step of laminating (37) the substrate sheets (46), antennas (43) and layers of adhesive (54). Said method is characterised by also comprising a step which consists of printing the inner surface of at least one of the substrate sheets (46) with a thickness-compensation layer (55), outside the substrate area (46) intended for receiving the antenna (43). |
申请公布号 |
WO2012136905(A1) |
申请公布日期 |
2012.10.11 |
申请号 |
WO2012FR00127 |
申请日期 |
2012.04.04 |
申请人 |
SMART PACKAGING SOLUTIONS (SPS);RIPERT, ANNE;VOLPE, PIERRE;CUENOT, YVES-PIERRE;HENAUT, GUILLAUME |
发明人 |
RIPERT, ANNE;VOLPE, PIERRE;CUENOT, YVES-PIERRE;HENAUT, GUILLAUME |
分类号 |
G06K19/077 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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