| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component which is mounted or removed without causing damage to an electronic component body, and to provide an electronic component assembly apparatus which mounts the electronic component on a substrate or remove the electronic component from the substrate. <P>SOLUTION: An electronic component includes: a wiring board; an electronic component body mounted on one surface side of the wiring board; an external electrode formed on the other surface of the wiring board and electrically connecting with the electronic component body; a heating element which is formed on the same layer as the external electrode and has conductivity and higher resistance than the external electrode; and a thermal insulation layer which is disposed between the electronic component body and the heating element, has insulation quality, and is made of materials different from materials forming the wiring board. <P>COPYRIGHT: (C)2013,JPO&INPIT |
